From 14th ~ 16th March of 2018, We attended 『SEMICON China 2018』 in Shanghai, as a manufacturer of semiconductor encapsulation mold die and system.
↑ Official Website
← Exhibition of Across videos and mold parts, brochures
Since we have delivered results in eleven countries, mainly in Japan, Southeast and East Asia, we will respond widely with reliable advanced technology. We are also customizing and developing since we asked about your problems and requests, mainly on semiconductor manufacturing equipment and precision molds. Please consult us once.
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- We exhibited at "SEMICON China 2018" in March 2018.
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Dazaifu City Fukuoka Prefecture Mizuki 1-11-11
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